• Industrial panel PC with Intel Iris Xe GPU for enhanced graphics and media acceleration
• 11th Gen Intel Core / Celeron processors with improved performance-per-watt
• Ultra-thin fanless enclosure, only 52.5 mm thickness for space-constrained installations
• Compact mechanical size: 250 × 195 × 52.5 mm
• Sealed aluminum housing, dust-resistant and vibration-tolerant design
• 2 × Gigabit LAN and 6 × COM ports for industrial connectivity
• Triple M.2 expansion supports NVMe SSD, Wi-Fi/Bluetooth, and 4G/5G modules
The IPPC-104V2-2L6C-11TH-09S is a compact industrial panel PC with Intel Iris Xe GPU, built on the 11th Gen Intel Tiger Lake platform. Compared with earlier generations, the integrated Iris Xe graphics provide a substantial improvement in graphics and media processing capability while maintaining low power consumption.
The system features a 9.7-inch TFT LCD and an ultra-thin, sealed aluminum enclosure measuring 250 × 195 × 52.5 mm. Its fanless design enhances reliability in dusty or vibration-prone industrial environments.
With 2 Gigabit LAN ports, 6 serial COM ports, multiple USB interfaces, and triple M.2 expansion for SSD and wireless modules, this industrial panel PC is well suited for edge AI inference, industrial HMI, kiosks, and intelligent automation applications.
LCD Display | Touchscreen | |||||||||
Display Type | 9.7″ TFT LCD (LED backlight) | Touchscreen Type | 5-Wire Resistive | Projected Capacitive | Non-Touchscreen | |||||
Resolution | 1024*768 | Touchscreen Method | Single point | Ten point | – | |||||
Luminance | 350 cd/m2 (Typ.) | Surface | 3H | 6H | 6H | |||||
Viewing Angle | 70/70/60/70 (Typ.)(CR>=10) | Durability | 1 million touches | – | – | |||||
Contrast Ratio | 500:1 (Typ.) ( Transmission ) | Transparency | 75%±8% | 85±3% | >88% | |||||
System | ||||||||||
CPU | Model | Intel® Core™ i7-1165G7 | Intel® Core™ i5-1135G7 | Intel® Core™ i3-1115G4 | Intel® Celeron® 6305E | |||||
Graphic | Intel® Iris® Xe Graphics, Up to 96 EUs,1.3Ghz | Intel® Iris® Xe Graphics, Up to 80 EUs,1.3Ghz | Intel® UHD Graphics, up to 48 EUs, 1.25Ghz | |||||||
RAM | SO-DIMM | 2* non-ECC SO-DIMM Socket, support DDR4-3200 MHz, up to 64GB | ||||||||
Storage | M.2 | 1* M.2 (NGFF) 2280 M-key Slot, support PCIex4 NVMe/ SATA3.0 SSD (PCIe x4 NVMe /SATA SSD sel by res, support SATA SSD by default. Intel® Core™ processor support Gen4 NVMe SSD, Intel® Celeron® processor support Gen3 NVMe SSD) | ||||||||
Supported OS | Windows & Linux | Win 8, Win 10; Win 10 IoT, Ubuntu, Dibian, Kali, CentOS, etc. | ||||||||
I/O INTERFACE | COM | 3 * RS232 (COM1/2/3, Header, Full lanes); 2 * RS232/TTL (COM4/5, Header, 3 lanes) ; 1 * RS232/RS485/TTL (COM6, Header, 3 lanes) (COM4/5/6 RS232/TTL sel by res, support RS232 by default. COM4/5/6 must be used at the same mode) | ||||||||
Ethernet | 2 * Intel® GBE LAN Chip (10/100/1000 Mbps, RJ45) | |||||||||
USB | 6* USB3.0; 4 * USB2.0 Internal Headers | |||||||||
Video | 2* HDMI(TYPE-A), max resolution up to 4096*2160@30Hz | |||||||||
Audio | 1 * Line-Out + MIC 2in1 3.5mm Jack; With 7.1 channel HD Audio Codec Realtek ALC897; 1 * Amplifier Header | |||||||||
SIM | 1* Built-in nano-SIM Card Slot connected to M.2 B-key slot | |||||||||
Power Supply | 12V DC; 1* DC Threaded Jack (5.5* 2.5mm) | |||||||||
Optional 9-30V DC PWR module with Terminal Block (2-Pin, 5.08mm) | ||||||||||
Other | 1* 8-bit GPIO header with 4 inputs and 4 outputs, Input voltage range: 0-5V; | |||||||||
Extended Capabilities | Additional Internal Interface | 1* M.2 (NGFF) E-key Slot (PCIe+USB2.0, Support WiFi+BT, 2230) 1* M.2 (NGFF) B-key Slot (PCIe/USB3.0+USB2.0, Support 5G+4G/3G, with 1* nano-SIM Card Slot, 3052) | ||||||||
Environment | Operating Temperature | Non-Touch: 0~50°C; Capacitive: -20~60°C; (w/ 0.7m/s Airflow) | ||||||||
Storage Temperature | Non-Touch: 0 ~ 50°C; Capacitive: -20 ~ 60°C | |||||||||
Relative Humidity | 40 °C @ 95%, Non-Condensing | |||||||||
Physical Characteristics | Dimensions | 250*195*52.5 mm | ||||||||
Net Weight | Around 2kg (The final weight is subject to actual ordering configuration) | |||||||||
Regulation | EMC | CE/FCC Class B, CCC | ||||||||
Safety | CE-LVD, RoHS, CCC | |||||||||
CPU | Code Name | Total Cores | Total Threads | Max Turbo Frequency | Base Frequency | Cache | TDP | Memory Types | Integrated Graphics |
Intel® Core™ I7-1165G7 | Tiger Lake | 4 | 8 | 4.70 GHz | 2.80 GHz | 12 MB Intel® Smart Cache | 12-28W | DDR4 | Intel®Iris Xe Graphics; 96Eus |
Intel® Core™ I5-1135G7 | Tiger Lake | 4 | 8 | 4.20 GHz | 2.40 GHz | 8 MB Intel® Smart Cache | 12-28W | DDR4 | Intel®Iris Xe Graphics; 80Eus |
Intel® Core™ I3-1115G4 | Tiger Lake | 2 | 4 | 4.10 GHz | 1.70 GHz | 4 MB Intel® Smart Cache | 12-28W | DDR4 | Intel®Iris Xe Graphics; 48Eus |
Intel® Celeron® 6305E | Tiger Lake | 2 | 2 | – | 1.80 GHz | 4 MB Intel® Smart Cache | 15W | DDR4 | Intel UHD Graphics |
Optional Items | Max Qty | Description |
DC9-30V TO DC-12V PWR module | 1 | PCB, Power supply voltage conversion module, connected by header |
Isolated 8-bit GPIO, 9-26V | 1 | Phoenix Terminal connector, connected by jumper |
Isolated RS-232 | 6 | DB9 or Phoenix Terminal connector, connected by header |
Isolated 8-bit GPIO, 9-24V | 1 | Phoenix Terminal connector, connected by header |
4G Module | 1 | Connected by M.2 interface |
5G Module | 1 | Connected by M.2 interface |
WiFi Module without AP mode | 1 | Connected by M.2 interface |
IPPC-104V2-2L6C-11TH-09S belongs to the All-in-One series, which is powered by 11th Gen Intel Core/ Celeron CPU with Intel® Iris® Xe Graphics, supports up to 64GB DDR4-3200, and supports dual independent displays via HDMI and VGA. It has a built-in mSATA3.0 slot and SIM card slot for easy desktop installation. It is dust, interference and temperature resistant. Comprehensive connectivity features include 2LAN, 6COM, multiple USB ports in a compact fanless design for edge computing, micro media servers, kiosks, PoS, retail, home or office use.
LCD Display | Touchscreen | |||||||||
Display Type | 9.7″ TFT LCD (LED backlight) | Touchscreen Type | 5-Wire Resistive | Projected Capacitive | Non-Touchscreen | |||||
Resolution | 1024*768 | Touchscreen Method | Single point | Ten point | – | |||||
Luminance | 350 cd/m2 (Typ.) | Surface | 3H | 6H | 6H | |||||
Viewing Angle | 70/70/60/70 (Typ.)(CR>=10) | Durability | 1 million touches | – | – | |||||
Contrast Ratio | 500:1 (Typ.) ( Transmission ) | Transparency | 75%±8% | 85±3% | >88% | |||||
System | ||||||||||
CPU | Model | Intel® Core™ i7-1165G7 | Intel® Core™ i5-1135G7 | Intel® Core™ i3-1115G4 | Intel® Celeron® 6305E | |||||
Graphic | Intel® Iris® Xe Graphics, Up to 96 EUs,1.3Ghz | Intel® Iris® Xe Graphics, Up to 80 EUs,1.3Ghz | Intel® UHD Graphics, up to 48 EUs, 1.25Ghz | |||||||
RAM | SO-DIMM | 2* non-ECC SO-DIMM Socket, support DDR4-3200 MHz, up to 64GB | ||||||||
Storage | M.2 | 1* M.2 (NGFF) 2280 M-key Slot, support PCIex4 NVMe/ SATA3.0 SSD (PCIe x4 NVMe /SATA SSD sel by res, support SATA SSD by default. Intel® Core™ processor support Gen4 NVMe SSD, Intel® Celeron® processor support Gen3 NVMe SSD) | ||||||||
Supported OS | Windows & Linux | Win 8, Win 10; Win 10 IoT, Ubuntu, Dibian, Kali, CentOS, etc. | ||||||||
I/O INTERFACE | COM | 3 * RS232 (COM1/2/3, Header, Full lanes); 2 * RS232/TTL (COM4/5, Header, 3 lanes) ; 1 * RS232/RS485/TTL (COM6, Header, 3 lanes) (COM4/5/6 RS232/TTL sel by res, support RS232 by default. COM4/5/6 must be used at the same mode) | ||||||||
Ethernet | 2 * Intel® GBE LAN Chip (10/100/1000 Mbps, RJ45) | |||||||||
USB | 6* USB3.0; 4 * USB2.0 Internal Headers | |||||||||
Video | 2* HDMI(TYPE-A), max resolution up to 4096*2160@30Hz | |||||||||
Audio | 1 * Line-Out + MIC 2in1 3.5mm Jack; With 7.1 channel HD Audio Codec Realtek ALC897; 1 * Amplifier Header | |||||||||
SIM | 1* Built-in nano-SIM Card Slot connected to M.2 B-key slot | |||||||||
Power Supply | 12V DC; 1* DC Threaded Jack (5.5* 2.5mm) | |||||||||
Optional 9-30V DC PWR module with Terminal Block (2-Pin, 5.08mm) | ||||||||||
Other | 1* 8-bit GPIO header with 4 inputs and 4 outputs, Input voltage range: 0-5V; | |||||||||
Extended Capabilities | Additional Internal Interface | 1* M.2 (NGFF) E-key Slot (PCIe+USB2.0, Support WiFi+BT, 2230) 1* M.2 (NGFF) B-key Slot (PCIe/USB3.0+USB2.0, Support 5G+4G/3G, with 1* nano-SIM Card Slot, 3052) | ||||||||
Environment | Operating Temperature | Non-Touch: 0~50°C; Capacitive: -20~60°C; (w/ 0.7m/s Airflow) | ||||||||
Storage Temperature | Non-Touch: 0 ~ 50°C; Capacitive: -20 ~ 60°C | |||||||||
Relative Humidity | 40 °C @ 95%, Non-Condensing | |||||||||
Physical Characteristics | Dimensions | 250*195*52.5 mm | ||||||||
Net Weight | Around 2kg (The final weight is subject to actual ordering configuration) | |||||||||
Regulation | EMC | CE/FCC Class B, CCC | ||||||||
Safety | CE-LVD, RoHS, CCC | |||||||||
Optional Items | Max Qty | Description |
DC9-30V TO DC-12V PWR module | 1 | PCB, Power supply voltage conversion module, connected by header |
Isolated 8-bit GPIO, 9-26V | 1 | Phoenix Terminal connector, connected by jumper |
Isolated RS-232 | 6 | DB9 or Phoenix Terminal connector, connected by header |
Isolated 8-bit GPIO, 9-24V | 1 | Phoenix Terminal connector, connected by header |
4G Module | 1 | Connected by M.2 interface |
5G Module | 1 | Connected by M.2 interface |
WiFi Module without AP mode | 1 | Connected by M.2 interface |
