IPPC-104V2-2L6C-11TH-12W

11th Gen industrial panel PC with 12-inch wide display, powered by Intel® Core™ 11th Gen processors and Iris® Xe graphics. Ultra-thin fanless design with sealed aluminum enclosure, optimized for space-constrained industrial environments. Compact dimensions of 315 × 215 × 56 mm, ideal for HMI, edge computing, kiosks, and automation control.

• Powered by Intel® 11th Gen Core™ / Celeron® processors with Iris® Xe graphics, delivering up to 2.9× faster graphics performance than previous generations.
• 12-inch industrial-grade display with narrow bezel design, optimized for compact HMI and control panels.
• Ultra-thin structure with an overall thickness of only 56 mm, saving installation space in cabinets and embedded systems.
• Fully sealed fanless aluminum enclosure, providing dustproof, anti-vibration, and anti-interference protection.
• Rich I/O configuration with 2× LAN, 6× COM, multiple USB ports, and triple M.2 expansion for SSD, Wi-Fi/BT, and 4G/5G modules.

The IPPC-104V2-2L6C-11TH-12W is a 11th Gen industrial panel PC designed for industrial automation, HMI, and edge computing applications.
Featuring a 12-inch wide-screen display and powered by Intel® 11th Gen Core™ processors with Iris® Xe graphics, it delivers significantly improved graphics and media performance compared with previous generations.
With a compact footprint of 315 × 215 × 56 mm and a fully sealed fanless aluminum enclosure, it is well suited for harsh industrial environments requiring reliability and long-term stability.

LCD Display

Touchscreen

Display Type

12.1″ TFT LCD (LED backlight)

Touchscreen Type

5-Wire Resistive

Projected Capacitive

Non-Touchscreen

Resolution

1280*800

Touchscreen Method

Single point

Ten point

Luminance

400 cd/m2 (Typ.)

Surface

3H

6H

6H

Viewing Angle

80/80/65/80 (Typ.)(CR>=10)

Durability

1 million touches

Contrast Ratio

800:1 (Typ.) ( Transmission )

Transparency

75%±8%

85±3%

>88%

System

CPU

Model

Intel® Core™ i7-1165G7

Intel® Core™ i5-1135G7

Intel® Core™ i3-1115G4

Intel® Celeron® 6305E

Graphic

Intel® Iris® Xe Graphics, Up to 96 EUs,1.3Ghz

Intel® Iris® Xe Graphics, Up to 80 EUs,1.3Ghz

Intel® UHD Graphics, up to 48 EUs, 1.25Ghz

RAM

SO-DIMM

2* non-ECC SO-DIMM Socket, support DDR4-3200 MHz, up to 64GB

Storage

M.2

1* M.2 (NGFF) 2280 M-key Slot, support PCIex4 NVMe/ SATA3.0 SSD (PCIe x4 NVMe /SATA SSD sel by res, support SATA SSD by default. Intel® Core™ processor support Gen4 NVMe SSD, Intel® Celeron® processor support Gen3 NVMe SSD)

Supported OS

Windows & Linux

Win 8, Win 10; Win 10 IoT, Ubuntu, Dibian, Kali, CentOS, etc.

I/O INTERFACE

COM

3 * RS232 (COM1/2/3, Header, Full lanes); 2 * RS232/TTL (COM4/5, Header, 3 lanes) ; 1 * RS232/RS485/TTL (COM6, Header, 3 lanes) (COM4/5/6 RS232/TTL sel by res, support RS232 by default. COM4/5/6 must be used at the same mode)

Ethernet

2 * Intel® GBE LAN Chip (10/100/1000 Mbps, RJ45)

USB

6* USB3.0; 4 * USB2.0 Internal Headers

Video

2* HDMI(TYPE-A), max resolution up to 4096*2160@30Hz

Audio

1 * Line-Out + MIC 2in1 3.5mm Jack; With 7.1 channel HD Audio Codec Realtek ALC897; 1 * Amplifier Header

SIM

1* Built-in nano-SIM Card Slot connected to M.2 B-key slot

Power Supply

12V DC; 1* DC Threaded Jack (5.5* 2.5mm)

Optional 9-30V DC PWR module with Terminal Block (2-Pin, 5.08mm)

Other

1* 8-bit GPIO header with 4 inputs and 4 outputs, Input voltage range: 0-5V;

Extended Capabilities

Additional Internal Interface

1* M.2 (NGFF) E-key Slot (PCIe+USB2.0, Support WiFi+BT, 2230)

1* M.2 (NGFF) B-key Slot (PCIe/USB3.0+USB2.0, Support 5G+4G/3G, with 1* nano-SIM Card Slot, 3052)

Environment

Operating Temperature

Non-Touch: -30~80°C; Capacitive: -20~70°C; Resistive: -10~50°C; (w/ 0.7m/s Airflow)

Storage Temperature

Non-Touch: -30 ~ 80°C; Capacitive: -20 ~ 70°C; Resistive: -20 ~ 50°C

Relative Humidity

40 °C @ 95%, Non-Condensing

Physical Characteristics

Dimensions

315*215*56 mm

Net Weight

Around 2.55kg (The final weight is subject to actual ordering configuration)

Regulation

EMC

CE/FCC Class B, CCC

Safety

CE-LVD, RoHS, CCC

Part No.

Brightness(cd/m2)

Touch Screen

Video & Audio I/O

Touchscreen Connector

Power Connector

Power Supply

IDP-0700W-CT

400

Projected Capacitive

VGA, DVI, HDMI, Audio In, Audio Out

USB

DC Threaded Jack

9-32V DC

IDP-0700W-RT

400

5-Wire Resistive

VGA, DVI, HDMI, Audio In, Audio Out

USB

DC Threaded Jack

9-32V DC

Optional Items

Max Qty

Description

DC9-30V TO DC-12V PWR module

1

PCB, Power supply voltage conversion module, connected by header

Isolated 8-bit GPIO, 9-26V

1

Phoenix Terminal connector, connected by jumper

Isolated RS-232

6

DB9 or Phoenix Terminal connector, connected by header

Isolated 8-bit GPIO, 9-24V

1

Phoenix Terminal connector, connected by header

4G Module

1

Connected by M.2 interface

5G Module

1

Connected by M.2 interface

WiFi Module without AP mode

1

Connected by M.2 interface

• Powered by Intel® 11th Gen Core™ / Celeron® processors with Iris® Xe graphics, delivering up to 2.9× faster graphics performance than previous generations.
• 12-inch industrial-grade display with narrow bezel design, optimized for compact HMI and control panels.
• Ultra-thin structure with an overall thickness of only 56 mm, saving installation space in cabinets and embedded systems.
• Fully sealed fanless aluminum enclosure, providing dustproof, anti-vibration, and anti-interference protection.
• Rich I/O configuration with 2× LAN, 6× COM, multiple USB ports, and triple M.2 expansion for SSD, Wi-Fi/BT, and 4G/5G modules.

The IPPC-104V2-2L6C-11TH-12W is a 11th Gen industrial panel PC designed for industrial automation, HMI, and edge computing applications.
Featuring a 12-inch wide-screen display and powered by Intel® 11th Gen Core™ processors with Iris® Xe graphics, it delivers significantly improved graphics and media performance compared with previous generations.
With a compact footprint of 315 × 215 × 56 mm and a fully sealed fanless aluminum enclosure, it is well suited for harsh industrial environments requiring reliability and long-term stability.

LCD Display

Touchscreen

Display Type

12.1″ TFT LCD (LED backlight)

Touchscreen Type

5-Wire Resistive

Projected Capacitive

Non-Touchscreen

Resolution

1280*800

Touchscreen Method

Single point

Ten point

Luminance

400 cd/m2 (Typ.)

Surface

3H

6H

6H

Viewing Angle

80/80/65/80 (Typ.)(CR>=10)

Durability

1 million touches

Contrast Ratio

800:1 (Typ.) ( Transmission )

Transparency

75%±8%

85±3%

>88%

System

CPU

Model

Intel® Core™ i7-1165G7

Intel® Core™ i5-1135G7

Intel® Core™ i3-1115G4

Intel® Celeron® 6305E

Graphic

Intel® Iris® Xe Graphics, Up to 96 EUs,1.3Ghz

Intel® Iris® Xe Graphics, Up to 80 EUs,1.3Ghz

Intel® UHD Graphics, up to 48 EUs, 1.25Ghz

RAM

SO-DIMM

2* non-ECC SO-DIMM Socket, support DDR4-3200 MHz, up to 64GB

Storage

M.2

1* M.2 (NGFF) 2280 M-key Slot, support PCIex4 NVMe/ SATA3.0 SSD (PCIe x4 NVMe /SATA SSD sel by res, support SATA SSD by default. Intel® Core™ processor support Gen4 NVMe SSD, Intel® Celeron® processor support Gen3 NVMe SSD)

Supported OS

Windows & Linux

Win 8, Win 10; Win 10 IoT, Ubuntu, Dibian, Kali, CentOS, etc.

I/O INTERFACE

COM

3 * RS232 (COM1/2/3, Header, Full lanes); 2 * RS232/TTL (COM4/5, Header, 3 lanes) ; 1 * RS232/RS485/TTL (COM6, Header, 3 lanes) (COM4/5/6 RS232/TTL sel by res, support RS232 by default. COM4/5/6 must be used at the same mode)

Ethernet

2 * Intel® GBE LAN Chip (10/100/1000 Mbps, RJ45)

USB

6* USB3.0; 4 * USB2.0 Internal Headers

Video

2* HDMI(TYPE-A), max resolution up to 4096*2160@30Hz

Audio

1 * Line-Out + MIC 2in1 3.5mm Jack; With 7.1 channel HD Audio Codec Realtek ALC897; 1 * Amplifier Header

SIM

1* Built-in nano-SIM Card Slot connected to M.2 B-key slot

Power Supply

12V DC; 1* DC Threaded Jack (5.5* 2.5mm)

Optional 9-30V DC PWR module with Terminal Block (2-Pin, 5.08mm)

Other

1* 8-bit GPIO header with 4 inputs and 4 outputs, Input voltage range: 0-5V;

Extended Capabilities

Additional Internal Interface

1* M.2 (NGFF) E-key Slot (PCIe+USB2.0, Support WiFi+BT, 2230)

1* M.2 (NGFF) B-key Slot (PCIe/USB3.0+USB2.0, Support 5G+4G/3G, with 1* nano-SIM Card Slot, 3052)

Environment

Operating Temperature

Non-Touch: -30~80°C; Capacitive: -20~70°C; Resistive: -10~50°C; (w/ 0.7m/s Airflow)

Storage Temperature

Non-Touch: -30 ~ 80°C; Capacitive: -20 ~ 70°C; Resistive: -20 ~ 50°C

Relative Humidity

40 °C @ 95%, Non-Condensing

Physical Characteristics

Dimensions

315*215*56 mm

Net Weight

Around 2.55kg (The final weight is subject to actual ordering configuration)

Regulation

EMC

CE/FCC Class B, CCC

Safety

CE-LVD, RoHS, CCC

Optional Items

Max Qty

Description

DC9-30V TO DC-12V PWR module

1

PCB, Power supply voltage conversion module, connected by header

Isolated 8-bit GPIO, 9-26V

1

Phoenix Terminal connector, connected by jumper

Isolated RS-232

6

DB9 or Phoenix Terminal connector, connected by header

Isolated 8-bit GPIO, 9-24V

1

Phoenix Terminal connector, connected by header

4G Module

1

Connected by M.2 interface

5G Module

1

Connected by M.2 interface

WiFi Module without AP mode

1

Connected by M.2 interface