IPPC-104V2-2L6C-11TH-10W

10.1-inch fanless industrial panel PC featuring an ultra-compact 259.6 × 177.6 mm front size, powered by 11th Gen Intel® Core™ processors. Designed for space-constrained HMI, kiosks, and embedded industrial control applications.

• 10.1-inch TFT LCD panel with compact industrial front size
• Ultra-compact dimensions: 259.6 × 177.6 × 50.5 mm for space-limited installations
• Fanless aluminum alloy enclosure for silent and maintenance-free operation
• 11th Gen Intel® Core™ / Celeron® processors with Intel® Iris® Xe graphics
• Rich industrial I/O: 2 × LAN, 6 × COM, multiple USB ports
• Triple M.2 expansion supporting NVMe SSD, WiFi/Bluetooth, and 4G/5G modules
• Designed for long-term industrial HMI, kiosk, and edge control deployments

This 10.1-inch industrial panel PC is designed for industrial HMI and embedded control environments where installation space, reliability, and thermal stability are critical. With a compact footprint of 259.6 × 177.6 × 50.5 mm, it fits seamlessly into control cabinets, kiosks, and machine panels.

Powered by 11th Gen Intel® Core™ and Celeron® processors with Intel® Iris® Xe graphics, the system supports up to 64GB DDR4 memory and dual independent display output. Its sealed aluminum alloy enclosure and fanless architecture ensure stable operation in dusty, vibration-prone industrial environments.

LCD Display

Touchscreen

Display Type

10.1″ TFT LCD (LED backlight)

Touchscreen Type

Projected Capacitive

Non-Touchscreen

Resolution

1280*800

Touchscreen Method

Ten point

Luminance

400 cd/m2 (Typ.)

Surface

6H

6H

Viewing Angle

85/85/85/85 (Typ.)(CR>=10)

Durability

Contrast Ratio

800:1 (Typ.) ( Transmission )

Transparency

85±3%

>88%

System

CPU

Model

Intel® Core™ i7-1165G7

Intel® Core™ i5-1135G7

Intel® Core™ i3-1115G4

Intel® Celeron® 6305E

Graphic

Intel® Iris® Xe Graphics, Up to 96 EUs,1.3Ghz

Intel® Iris® Xe Graphics, Up to 80 EUs,1.3Ghz

Intel® UHD Graphics, up to 48 EUs, 1.25Ghz

RAM

SO-DIMM

2* non-ECC SO-DIMM Socket, support DDR4-3200 MHz, up to 64GB

Storage

M.2

1* M.2 (NGFF) 2280 M-key Slot, support PCIex4 NVMe/ SATA3.0 SSD (PCIe x4 NVMe /SATA SSD sel by res, support SATA SSD by default. Intel® Core™ processor support Gen4 NVMe SSD, Intel® Celeron® processor support Gen3 NVMe SSD)

Supported OS

Windows & Linux

Win 8, Win 10; Win 10 IoT, Ubuntu, Dibian, Kali, CentOS, etc.

I/O INTERFACE

COM

3 * RS232 (COM1/2/3, Header, Full lanes); 2 * RS232/TTL (COM4/5, Header, 3 lanes) ; 1 * RS232/RS485/TTL (COM6, Header, 3 lanes) (COM4/5/6 RS232/TTL sel by res, support RS232 by default. COM4/5/6 must be used at the same mode)

Ethernet

2 * Intel® GBE LAN Chip (10/100/1000 Mbps, RJ45)

USB

6* USB3.0; 4 * USB2.0 Internal Headers

Video

2* HDMI(TYPE-A), max resolution up to 4096*2160@30Hz

Audio

1 * Line-Out + MIC 2in1 3.5mm Jack; With 7.1 channel HD Audio Codec Realtek ALC897; 1 * Amplifier Header

SIM

1* Built-in nano-SIM Card Slot connected to M.2 B-key slot

Power Supply

12V DC; 1* DC Threaded Jack (5.5* 2.5mm)

Optional 9-30V DC PWR module with Terminal Block (2-Pin, 5.08mm)

Other

1* 8-bit GPIO header with 4 inputs and 4 outputs, Input voltage range: 0-5V;

Extended Capabilities

Additional Internal Interface

1* M.2 (NGFF) E-key Slot (PCIe+USB2.0, Support WiFi+BT, 2230)

1* M.2 (NGFF) B-key Slot (PCIe/USB3.0+USB2.0, Support 5G+4G/3G, with 1* nano-SIM Card Slot, 3052)

Environment

Operating Temperature

Non-Touch: 0~50°C; Capacitive: -20~60°C; (w/ 0.7m/s Airflow)

Storage Temperature

Non-Touch: 0 ~ 50°C; Capacitive: -20 ~ 60°C

Relative Humidity

40 °C @ 95%, Non-Condensing

Physical Characteristics

Dimensions

259.6*177.6*50.5 mm

Net Weight

Around 2.2kg (The final weight is subject to actual ordering configuration)

Regulation

EMC

CE/FCC Class B, CCC

Safety

CE-LVD, RoHS, CCC

 CPU

 Code Name

Total Cores

Total Threads

Max Turbo Frequency

Base Frequency

 Cache

 TDP

Memory Types

 Integrated Graphics

Intel® Core™ I7-1165G7

Tiger Lake

4

8

4.70 GHz

2.80 GHz

12 MB Intel® Smart Cache

12-28W

DDR4

Intel®Iris Xe Graphics; 96Eus

Intel® Core™ I5-1135G7

Tiger Lake

4

8

4.20 GHz

2.40 GHz

8 MB Intel® Smart Cache

12-28W

DDR4

Intel®Iris Xe Graphics; 80Eus

Intel® Core™ I3-1115G4

Tiger Lake

2

4

4.10 GHz

1.70 GHz

4 MB Intel® Smart Cache

12-28W

DDR4

Intel®Iris Xe Graphics; 48Eus

Intel® Celeron® 6305E

Tiger Lake

2

2

  –

1.80 GHz

4 MB Intel® Smart Cache

15W

DDR4

Intel UHD Graphics

Optional Items

Max Qty

Description

DC9-30V TO DC-12V PWR module

1

PCB, Power supply voltage conversion module, connected by header

Isolated 8-bit GPIO, 9-26V

1

Phoenix Terminal connector, connected by jumper

Isolated RS-232

6

DB9 or Phoenix Terminal connector, connected by header

Isolated 8-bit GPIO, 9-24V

1

Phoenix Terminal connector, connected by header

4G Module

1

Connected by M.2 interface

5G Module

1

Connected by M.2 interface

WiFi Module without AP mode

1

Connected by M.2 interface

• 10.1-inch TFT LCD panel with compact industrial front size
• Ultra-compact dimensions: 259.6 × 177.6 × 50.5 mm for space-limited installations
• Fanless aluminum alloy enclosure for silent and maintenance-free operation
• 11th Gen Intel® Core™ / Celeron® processors with Intel® Iris® Xe graphics
• Rich industrial I/O: 2 × LAN, 6 × COM, multiple USB ports
• Triple M.2 expansion supporting NVMe SSD, WiFi/Bluetooth, and 4G/5G modules
• Designed for long-term industrial HMI, kiosk, and edge control deployments

This 10.1-inch industrial panel PC is designed for industrial HMI and embedded control environments where installation space, reliability, and thermal stability are critical. With a compact footprint of 259.6 × 177.6 × 50.5 mm, it fits seamlessly into control cabinets, kiosks, and machine panels.

Powered by 11th Gen Intel® Core™ and Celeron® processors with Intel® Iris® Xe graphics, the system supports up to 64GB DDR4 memory and dual independent display output. Its sealed aluminum alloy enclosure and fanless architecture ensure stable operation in dusty, vibration-prone industrial environments.

LCD Display

Touchscreen

Display Type

10.1″ TFT LCD (LED backlight)

Touchscreen Type

Projected Capacitive

Non-Touchscreen

Resolution

1280*800

Touchscreen Method

Ten point

Luminance

400 cd/m2 (Typ.)

Surface

6H

6H

Viewing Angle

85/85/85/85 (Typ.)(CR>=10)

Durability

Contrast Ratio

800:1 (Typ.) ( Transmission )

Transparency

85±3%

>88%

System

CPU

Model

Intel® Core™ i7-1165G7

Intel® Core™ i5-1135G7

Intel® Core™ i3-1115G4

Intel® Celeron® 6305E

Graphic

Intel® Iris® Xe Graphics, Up to 96 EUs,1.3Ghz

Intel® Iris® Xe Graphics, Up to 80 EUs,1.3Ghz

Intel® UHD Graphics, up to 48 EUs, 1.25Ghz

RAM

SO-DIMM

2* non-ECC SO-DIMM Socket, support DDR4-3200 MHz, up to 64GB

Storage

M.2

1* M.2 (NGFF) 2280 M-key Slot, support PCIex4 NVMe/ SATA3.0 SSD (PCIe x4 NVMe /SATA SSD sel by res, support SATA SSD by default. Intel® Core™ processor support Gen4 NVMe SSD, Intel® Celeron® processor support Gen3 NVMe SSD)

Supported OS

Windows & Linux

Win 8, Win 10; Win 10 IoT, Ubuntu, Dibian, Kali, CentOS, etc.

I/O INTERFACE

COM

3 * RS232 (COM1/2/3, Header, Full lanes); 2 * RS232/TTL (COM4/5, Header, 3 lanes) ; 1 * RS232/RS485/TTL (COM6, Header, 3 lanes) (COM4/5/6 RS232/TTL sel by res, support RS232 by default. COM4/5/6 must be used at the same mode)

Ethernet

2 * Intel® GBE LAN Chip (10/100/1000 Mbps, RJ45)

USB

6* USB3.0; 4 * USB2.0 Internal Headers

Video

2* HDMI(TYPE-A), max resolution up to 4096*2160@30Hz

Audio

1 * Line-Out + MIC 2in1 3.5mm Jack; With 7.1 channel HD Audio Codec Realtek ALC897; 1 * Amplifier Header

SIM

1* Built-in nano-SIM Card Slot connected to M.2 B-key slot

Power Supply

12V DC; 1* DC Threaded Jack (5.5* 2.5mm)

Optional 9-30V DC PWR module with Terminal Block (2-Pin, 5.08mm)

Other

1* 8-bit GPIO header with 4 inputs and 4 outputs, Input voltage range: 0-5V;

Extended Capabilities

Additional Internal Interface

1* M.2 (NGFF) E-key Slot (PCIe+USB2.0, Support WiFi+BT, 2230)

1* M.2 (NGFF) B-key Slot (PCIe/USB3.0+USB2.0, Support 5G+4G/3G, with 1* nano-SIM Card Slot, 3052)

Environment

Operating Temperature

Non-Touch: 0~50°C; Capacitive: -20~60°C; (w/ 0.7m/s Airflow)

Storage Temperature

Non-Touch: 0 ~ 50°C; Capacitive: -20 ~ 60°C

Relative Humidity

40 °C @ 95%, Non-Condensing

Physical Characteristics

Dimensions

259.6*177.6*50.5 mm

Net Weight

Around 2.2kg (The final weight is subject to actual ordering configuration)

Regulation

EMC

CE/FCC Class B, CCC

Safety

CE-LVD, RoHS, CCC

Optional Items

Max Qty

Description

DC9-30V TO DC-12V PWR module

1

PCB, Power supply voltage conversion module, connected by header

Isolated 8-bit GPIO, 9-26V

1

Phoenix Terminal connector, connected by jumper

Isolated RS-232

6

DB9 or Phoenix Terminal connector, connected by header

Isolated 8-bit GPIO, 9-24V

1

Phoenix Terminal connector, connected by header

4G Module

1

Connected by M.2 interface

5G Module

1

Connected by M.2 interface

WiFi Module without AP mode

1

Connected by M.2 interface